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New Stamping Process Creates Metallic Interconnects, Nanostructures
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Written by Gizmo   
Wednesday, 28 February 2007 06:30
Creating high-resolution metallic interconnects is an essential part of the fabrication of microchips and other nanoscale devices. Researchers at the University of Illinois at Urbana-Champaign have developed a simple and robust electrochemical process for the direct patterning of metallic interconnects and other nanostructures.

Read the full story at Science Daily:

"Solid-state superionic stamping offers a new approach, both as a stand-alone process and as a complement to other nanofabrication techniques, for creating chemical sensors, photonic structures and electrical interconnects," said Nicholas X. Fang, a professor of mechanical science and engineering, and corresponding author of a paper published in the Feb. 14 issue of the journal Nano Letters.

The S4 process uses a patterned superionic material as a stamp, and etches a metallic film by an electrochemical reaction. In superionic materials, metal ions can move almost freely around the crystal lattice. These mobile materials can also be used in batteries and fuel cells.

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