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IBM's chip stacking breakthrough
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Written by Danrok   
Friday, 13 April 2007 07:39

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Silicon wafer.
From DailyTech:

New IBM tech shortens wire lengths inside chips up to 1000 times

IBM is detailing a new breakthrough in three-dimensional chip-stacking technique that allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems. The company claims that the technology will extend Moore’s Law beyond its expected limits.

3D chip stacking takes chips and memory devices that traditionally sit side by side on a silicon wafer and stacks them together on top of one another. The result is a compact sandwich of components that dramatically reduces the size of the overall chip package and boosts the speed at which data flows among the functions on the chip.

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