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IBM claims self-assembling chip leap
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Written by MONKEYMAN   
Thursday, 10 May 2007 07:31

From The Register:

"IBM's highly boffinated research division delivered today when the firm said it would be first to deploy self-assembly microchip nanotechnology on an industrial scale.

The self-assembling material can be coaxed by a scaffold to form vacuum cavities, which improve electrical transmission by reducing transmission between supposedly separate parts of the circuit. Leakage between adjacent wires can release heat into the chip, damping performance, so a vacuum, the ultimate insulator for this "wiring capacitance" should speed things along - IBM says by 35 per cent."

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