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AMD goes 'green' with lead-free bumping
Written by Gizmo   
Wednesday, 20 December 2006 17:04

Read the full story at EE Times:

"Advanced Micro Devices Inc. (AMD) has entered into an agreement to license Amkor Technology Inc.'s lead free (Pb-free) electroplated wafer bumping technology. Terms of the license agreement were not disclosed.

The electronics industry is striving to reduce or eliminate certain elements and compounds, such as lead, mercury, cadmium and halogen, in favor of "Green" products in response to legislation in Europe and Japan.

Wafer bumping is the process of depositing tiny solder 'bumps' onto fabricated semiconductor wafers and is a key step in creating flip chip-based IC packages. The growing adoption of flip chip packaging, coupled with the 'Green' electronics movement, means that semiconductor manufacturers will increasingly turn to Pb-free wafer bumping technology."

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