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45 to 32 nm: Another Evolutionary Transition
Written by Gizmo   
Wednesday, 24 January 2007 20:02

Read the full story at Semiconductor International:

"Those expecting more revolutionary changes at the 32 nm node may be disappointed by the evolutionary changes in process technology that still allow performance specifications of the latest devices to be met. Still, there are a few notable exceptions.

Like the 45 nm generation, the 32 nm node will take advantage of the performance tricks of the prior technology generation, including immersion lithography, multiple stressors for mobility enhancement and porous low-k materials in the interconnect. The biggest change at 32 nm will be the introduction of high-k dielectrics and metal gates into production, though different approaches are likely to be taken. Other highlights are copper plugs and 3-D integration."

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