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Industry socked by next-gen litho woes
Written by Gizmo   
Wednesday, 07 March 2007 06:35
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on extreme-ultraviolet (EUV) lithography for IC production, but the most likely alternative--a version of 193-nanometer immersion--is proving expensive. The added costs could have some serious implications for chip scaling.

Read the full story at EETimes:

At last week's SPIE Advanced Lithography conference here, there were troubling signs that oft-delayed EUV technology could get pushed out even further, to the 16-nm node, in 2013--if it materializes at all. That could set back leading-edge chip makers such as Intel and Samsung, which were hoping to get their hands on working EUV tools for the early-development phases of the 22-nm node in 2011.


EUV's problems open the door for a crop of emerging technologies, such as immersion, maskless and nanoimprint lithography. But at least for the 32- and 22-nm nodes, the leading contender is 193-nm immersion, equipped with the new buzzwords "double exposure" and "double patterning."

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